Sorting & Metrology Equipment
Bare wafer geometry metrology systems for wafer manufacturers.
Model 300-TRT
Wafer diameter: 300mm (option 200mm)
Throughput: Max. 450 wafer per hour on one center-point measurement
None Contact Gauges: Thickness, Resistivity, Type, OCR
Surface: As-Cut, Lapped, Polished
Wafer Handling: Standard Robot and Belt arrangement
Measurement: Center point, 2-point Resistivity and radial grading
Cassette: 25 slot & 13 slot
Configuration: (4) input station (12) output station precision and stability multiple-point measurement on one axis for thickness, type, resistivity, and OCR
Dual-sided sensor
Applications: Outgoing wafer quality control and wafer process monitoring and control
Model 200-TRT
High precision and stability multiple-point measurement on one axis for thickness, type, resistivity map
Easy Operation touch screen PC with advanced recipe-control software
Maximum 1000 wafers per hour throughput on one center-point measurement
Measures thickness and resistivity, .0007 ohm - 150 ohm cm
All sensors are non-contact; radial gradient measurements are available
Every cassette is independently programmable
Reliable and easy to maintain belt system
Cleanroom compatible
Bow, warp, TTV, STIR, OCR top and bottom, and more
All wafer materials: SiC, Si, Glass, etc.
Dual-sided sensor
Applications: Outgoing wafer quality control and wafer process monitoring and control
Model TRTS-300
Wafer diameter measurement sets: 4" / 5" / 6" / 8"/12”
Manual load/unload
None Contact Gauges: Thickness, Resistivity, Type
Surface: As-Cut, Lapped, Polished
Wafer Handling: Standard Robot and Belt arrangement
Measurement: Center point, 2-point Resistivity and radial grading
Dual-sided sensor
Applications: Outgoing wafer quality control and wafer process monitoring and control