Edge Grinders

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Model EP1401, EP2601, EP3801 Edge Grinder - diameter from 50mm to 200mm

• Round, Notched, or flatted wafers
• Non contact thickness measuring system
• Grind measurement station (diameter, flat length(s), notch depth, location
• 4 cassette loading/unloading station
• High throughput
• Windows XP system

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Model 18-20 Wafer Demount Station    

• Fits model 3808 or 3806 Polisher carriers.
• Wafer sizes utilized are 4”, 5”, 6” and 8” diameter
• One cassette in one column unload a total of 25 wafers
• The Demount Station can also accommodate other carriers and   wafer sizes
• Easy “slide-into-place” carrier loading system
• Auto carrier rotation
• Automatic indexing
• Wafer breakage prevention, when wafer is not fully inserted in cassette
• Water saving operation, as the water shuts off when the system is not in use
• Wafer submerged in DI Water to avoid slurry damage and haze

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Model MS-200 Mount Press – All Template Carrier for Polishing

• The Model MS-200 Mount Station uses heat and pressure to press wafers into the template, which is mounted on the polishing carrier.
• Allows consistency of polishing process
• Removes excess water from wafer/template interface
• Removes operator inconsistencies from process.